Analysis & Simulation

AcAe delivers advanced analysis and simulation services that support high-speed digital, RF, mixed-signal, and power-dense electronic designs. Our work integrates signal integrity (SI), power integrity (PI), thermal, and EMI/EMC analysis directly into the design cycle to reduce re-spins, eliminate late-stage failures, and ensure predictable manufacturing outcomes.

This is not post-layout troubleshooting. It is analysis-driven design engineering.

As data rates increase, power margins shrink, and form factors tighten, analysis has shifted from optional validation to a core design discipline. AcAe provides analysis engineered for:

• Multi-gigabit SERDES, DDR, and high-speed interfaces
• Power-dense designs with aggressive transient loads
• RF and mixed-signal coexistence
• Thermal-constrained form factors and enclosures
• EMI/EMC compliance-driven products 
• Schedule-critical programs where re-spins are not acceptable

Our analysis work is tightly coupled to schematic, layout, and manufacturing decisions — not performed in isolation.

Signal Integrity (SI)

Behavior of high-speed signals across interconnects, including:

• Timing, reflections, ringing, and overshoot
• Crosstalk and return-path integrity
• Differential pair behavior and skew 
• Channel performance for SERDES and memory interfaces

Power Integrity (PI)

Stability and performance of power delivery networks, including:

• PDN impedance and resonance behavior
• Transient load response
• Decoupling strategies and capacitor selection 
• IR drop and noise coupling

Thermal Analysis

Thermal performance of boards and systems, including:

• Steady-state and transient thermal behavior
• Hotspot identification and mitigation
• Heat spreading, dissipation, and airflow considerations 
• Component derating and reliability risk

EMI / EMC

Electromagnetic behavior affecting emissions and susceptibility, including:

• Noise coupling paths and return current analysis
• Grounding and shielding strategies
• Filtering effectiveness
• Pre-compliance risk identification and mitigation

To begin an analysis engagement, we typically work with some or all of the following:

• Schematic and PCB design data
• Stackup and material definitions
• Interface specifications and performance targets
• Power requirements and load profiles
• Mechanical constraints and enclosure context 
• Regulatory or compliance requirements (if applicable)

Where analysis is required earlier in the design cycle, AcAe assists in defining assumptions and constraints to enable meaningful pre-layout simulation.

AcAe integrates analysis into the design flow through a structured, repeatable process:

1. Requirements & Risk Identification

Review of interfaces, power domains, thermal constraints, and EMI/EMC risk areas.

2. Pre-Layout Analysis & Guidance

Definition of constraints, stackups, PDN strategies, and layout guidance before routing begins.

3. Constraint-Driven Design Support

Ongoing analysis support as layout progresses to validate adherence to performance targets.

4. Post-Layout Verification

Validation of critical nets, power domains, and thermal behavior against expected performance.

5. Issue Resolution & Optimization

Targeted recommendations to balance performance, manufacturability, and cost.

AcAe performs analysis and simulation using industry-leading platforms, including:

• Ansys SIwave / HFSS
• Cadence Sigrity
• Siemens / Mentor HyperLynx
• Keysight ADS
• Integrated workflows with Allegro, Xpedition, Altium, Zuken, and more

Our analysts work directly in your environment or through AcAe secure analysis infrastructure.

Analysis-Only Engagements

Independent SI, PI, thermal, or EMI/EMC analysis for in-house designs.

Co-Development with Design Teams
Embedded analysts working alongside schematic and layout teams.

Turnkey Analysis Programs
Full ownership of analysis across a product or platform.

Root-Cause & Debug Support
Targeted investigation of existing signal, power, thermal, or EMI failures.

SI/PI-Driven Design Pedigree
Analysis is embedded early, where it has the greatest impact.

Multi-Domain Expertise
SI, PI, thermal, and EMI/EMC are treated as interconnected disciplines.

Reduced Re-Spins & Faster Schedules
Early analysis eliminates late-stage surprises and schedule delays.

Manufacturing-Aware Recommendations
Solutions balance performance with fabrication and assembly realities.

Integrated with the Full AcAe Ecosystem
Analysis aligns seamlessly with PCB design, libraries, translation, layout, and manufacturing support.